Silicon Power Presents the New Heat Sink of Xpower DDR3 Memory Module

Written by Contributor

November 27, 2014

Xpower2014

SP/Silicon Power, the world’s leading provider of memory storage solutions unveils the new heat sink of Xpower DDR3 Overclocking series memory module. Built in a special-made metallic heat sink, the new Xpower DDR3 is able to provide a better cooling solution and increase the heat dissipation area, maintaining a powerful speed and stability to meet the needs of overclocking enthusiasts and hardcore gamers.

Silicon Power new Xpower DDR3 Overclocking series are available in various duel channel kits in DDR3-1600, 1866, 2133, and 2400 MHz variants, reaching the high capacity from 8GB (4GBx2) to 16GB (8GBx2). Compatible with Intel® Core™ Gen 3 and the latest Z77 platform, Xpower Overclocking series can maximize the transfer speed, unleashing the extreme system performance to the next level.

Silicon Power’s Xpower DDR3 Overclocking series are 100% tested for dual channel operation. These are high performance Overclocking memory modules with stability and compatibility guaranteed. The large memory capacity and enhanced cooling solution is ideal for photo and video editing, hardcore gaming necessities, as well as system upgrade desires.

Product Specifications:

  • Memory module type: Xpower DDR3 Memory
  • Pins: 240Pin UDIMM without ECC
  • Speed: DDR3-1600 / 1866 / 2133 / 2400
  • CAS Latency: 9 (1600/1866) / 11 (2133/2400)
  • Capacity: 8GB(4GBx2) / 16GB(8GBx2)
  • DRAM chip spec.: 4Gb(512Mx8bit) (single chip density)
  • Operating voltage: 1.65 V
  • Support Intel® Extreme Memory Profile (XMP)
  • Lifetime warranty

 

SP Official Facebook: www.facebook.com/SiliconPowerPH

SP Official Website: www.silicon-power.com

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